Dynax Semiconductor, Inc. was founded in 2011, with its headquarters located in Jiangsu Suzhou Kunshan Hi-Tech Zone. The company adopts the business mode of integrated device manufacturer (IDM) and conducts the R&D and commercialization of wide band gap (WBG) semiconductor GaN power semiconductor chips, devices and modules for the first time in China. The company provides high-efficiency power semiconductor products and solutions in the field of RF, such as 5G communication base station, radar and WBG, and in the field of electricity and electronics, such as industrial control, power supply and electrical vehicles.
Products
CORE TECHNOLOGY
Advanced Power Semiconductor Technology
High-Efficiency Semiconductor Technology for RF and Power Applications
GaN Power Semiconductor
Telink was one of the first companies to deliver solutions for Bluetooth LE Mesh, which is now the fastest-growing smart home/smart lighting standard and has been adopted in most Tier 1 ecosystems.
RF Semiconductor
Telink was one of the first companies to deliver solutions for Bluetooth LE Mesh, which is now the fastest-growing smart home/smart lighting standard and has been adopted in most Tier 1 ecosystems.
WBG Technology
Integrate devices with Tier 1 customers’ platforms on Telink’s reliable, mature, and cost-efficient 802.15.4 SoCs and protocol stack.
Power Semiconductor
Certified by Thread, Telink can help customers quickly develop IoT smart devices that comply with both the Thread protocol and Matter standards.
PRODUCT PORTFOLIO
We offer a wide range of Dynax semiconductor products tailored to customers’ application needs and design requirements.
Ceramic package discrete
tube amplifier
Ceramic Package Discrete Amplifiers for high-reliability RF applications.
Plastic package discrete amplifier
Plastic Package Discrete Amplifiers suitable for a variety of RF systems.
Integrated multi-chip
module
Highly Integrated Module Solutions integrating multiple chips.
H-series Bare Die
(Standard products)
H-Series Bare Die for RF and power applications.
J-series Bare Die
(Standard products)
J-Series Bare Die for high-efficiency RF and power designs.
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Discover New Possibilities in Dynax Power
Semiconductor Solutions
MCT delivers optimized GaN- and WBG-based power semiconductor solutions from Dynax for a wide range of applications, including RF, 5G communications, radar, industrial power systems, and electric vehicles. From product selection and sample supply to customized FAE services, we provide integrated solutions tailored to each customer's development environment and technical requirements.